Citation
(2001), "Advanced packaging technologies in the electronics industry", Microelectronics International, Vol. 18 No. 1. https://doi.org/10.1108/mi.2001.21818aac.005
Publisher
:Emerald Group Publishing Limited
Copyright © 2001, MCB UP Limited
Advanced packaging technologies in the electronics industry
Advanced packaging technologies in the electronics industry
Delegates are invited to participate in the SMTA national conference (in Boston, 13-14 June 2001) on Advanced Packaging Technologies in the Electronics Industry. The two industry areas that are being addressed for this conference are "Progress in lead free soldering technology" and "Packaging technology for the telecommunications industry".
Further details: http://www.smta.org/education/symposia/symposia.cfm#SMTABoston