Keywords
Citation
(2001), "EuroSimE 2001 2nd International Conference", Microelectronics International, Vol. 18 No. 1. https://doi.org/10.1108/mi.2001.21818aac.002
Publisher
:Emerald Group Publishing Limited
Copyright © 2001, MCB UP Limited
EuroSimE 2001 2nd International Conference
EuroSimE 2001 – 2nd International Conference
Keywords: Conferences, Simulation, Microelectronics
9-11 April, Paris, France
Among the technology trends of the electronics industry is the rapid development and ever-increasing application of advanced simulation methodologies and tools. For the leading global companies, simulation is becoming a daily practice, a standard tool, and an important edge for achieving competitive product and/or process development.
Thermal, thermo-mechanical and mechanical simulations have significant impact on the profitability of electronics industries. On the other hand, the fascinating development of the electronics industry has also brought many challenges and impulses for the further development of simulation methodologies and tools. As the only international conference specially dedicated to mechanical and thermal simulation in (micro)-electronics, EuroSimE 2000 was initiated by COMPETE with major sponsorship from the European Community. The second in the series, EuroSimE 2001 aims to:
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promote further development and application of simulation methodologies and tools for the electronics industry;
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improve communication and exchange information between methodology and tool-developers and industry users;
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strengthen co-operation between industry, universities and research institutes.
EuroSimE 2001 will address the results of both fundamental research and industrial application in the fields of thermal and mechanical simulation in (micro)-electronics.
The applications will cover all fields of (micro)-electronics including, but not limited to:
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Wafer processing and chip design.
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PWB design and application.
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Components and packaging (traditional packages, flip-chip, BGA, CSP, wafer-level packages, MCM, opto-electronic packages, MEMS).
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Microsystems.
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Interconnections.
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Materials of (micro)-electronics.
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Processes in (micro)-electronics.
In addition to the technical programme, short courses for professional training will be offered on 8 April.
The deadline for submission of a 500-word abstract was 15 November 2000.
Further details: http://www.compete.tm.fr/eurosime/eurosime.htm