Keywords
Citation
(2001), "SMT/ES+S/HYBRID exhibition changes name", Microelectronics International, Vol. 18 No. 1. https://doi.org/10.1108/mi.2001.21818aab.012
Publisher
:Emerald Group Publishing Limited
Copyright © 2001, MCB UP Limited
SMT/ES+S/HYBRID exhibition changes name
SMT/ES+S/HYBRID exhibition changes name
Keyword: Exhibitions
The SMT/ES&S/Hybrid conference and exhibition is synonymous with the best in system integration in microelectronics and has a reputation for revealing the trends and developments within the industry.
The electronics industry is expecting extensive technological changes. Interconnection technologies (packaging) based on wafers and PCBs will become the key technologies and play a significant role in determining the functionality, quality and cost-effectiveness of microelectronical and microsystem products. The rapidly increasing market requirements for electronic products (smaller and able to reduce costs and energy consumption) can only be realized with the use of modern packaging technologies for the production of electronic devices (for example, bonding and packaging technologies, circuit technology and PCB technologies).
In short, packaging is the technological key competence of the future. We are therefore giving packaging the status it deserves.
Europe's special interest event on system integration in microelectronics and the only real platform for new interconnection technologies will be called SMT/HYBRID/PACKAGING from now on.
The event will continue to cover all relevant areas such as components, ASICs, hybrids, CAE, EDA, PCBs, screenprinting, assembly, soldering, packaging (chip-on-board, flip chip, chip scale packaging and ball grid arrays) and testing – everything presented clearly under one roof. Exhibitors as well as visitors with high decision-making competence already highly value the clear thematical focus, as proven every year by the successful figures for the event. For the upcoming event from 24-26 April 2001 more than 650 exhibitors and 25,000 trade visitors are expected once again in Nuremberg.
Further details: MESAGO Messe & Kongress GmbH, Tanja Waglohner/Petra Buss. Tel: +49-711-61946-72/38; Fax: +49-711-61946-94; Web site: http://www.mesago.de/smt