Keywords
Citation
(2001), "MRSI 505 opens eutectic die attach lab facility", Microelectronics International, Vol. 18 No. 1. https://doi.org/10.1108/mi.2001.21818aab.009
Publisher
:Emerald Group Publishing Limited
Copyright © 2001, MCB UP Limited
MRSI 505 opens eutectic die attach lab facility
MRSI 505 opens eutectic die attach lab facility
Keywords: MRSI, Die attach
Electronics manufacturers assembling microwave, optical, and RF modules, as well as other advanced packages requiring eutectic die attach processes, now have a resource for process development at MRSI headquarters in Chelmsford, Massachusetts, USA. MRSI has opened a eutectic die attach lab facility and demo facility in the company's engineering department, where customers will be able to test their products with the help of MRSI's engineering staff and dedicated equipment, including the MRSI 505 Assembly Work Cell. This flexible system supports direct gold/silicon eutectic and eutectic reflow using gold/tin and gold/germanium preforms. The system uses programmable closed loop temperature control, programmable up to 450°C, for eutectic bonding. Visitors to the facility will be able to investigate the process of direct gold silicon eutectic die attach, as well as gold tin or gold germanium reflow, and other options.