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Emerald Group Publishing Limited
Copyright © 2001, MCB UP Limited
Keywords: IMAPS, Conferences
Advanced Technology Workshop on Thermal Management for High-performance Computing and Wireless Applications
This workshop is organized each year by IMAPS as a review of leading-edge developments in thermal management components and materials, to promote discussion of very recent developments and newly-announced solutions and concepts for removing, spreading, and dissipating heat from microelectronic devices in high-performance electronics applications.
The 2001 ATW will be focused on high-performance applications in computing (server, enterprise server, workstation, desktop, and mobile/handheld systems) and wireless/RF systems. This Workshop is intended to provide a forum for technical communications for design, analysis, characterization, and application of such proposed or implemented solutions at the component level and for examination of overall system packaging technologies. An additional session on market drivers and economics will be added for the 2001 ATW and abstracts are now being solicited for all five sessions. This Workshop begins immediately following the HDI Conference in Santa Clara, California.
The Advanced Technology Workshop on Thermal Management and Heat Spreaders has been held since 1992 and is considered to be one of the most successful of the IMAPS ATWs that are held each year.
Deadline for abstracts: 15 January 2001
IMAPS Advanced Technology Workshop on Thermal Management for High-performance Computing and Wireless Applications, Sheraton Palo Alto Hotel, Palo Alto, California, USA, 20-21 April 2001.
Papers are solicited in the following areas:
Computing systems: system-level thermal management solutions for high-performance computing systems, examining implementation of novel and practical solutions for thermal management at the system level. This may encompass large computing servers, enterprise servers, notebook and mobile microprocessor applications, commercial and consumer PCs and handheld systems. This topic will comprise two sessions.
Wireless systems: system-level thermal management solutions for high-performance wireless and RF systems, examining implementation of novel and practical solutions for thermal management at the system level. This session will include telecommunications infrastructure and handheld telephony, optoelectronics, and advanced power electronic systems. This topic will be a single session.
Thermal materials: innovative developments in thermal materials for high-performance processors, memory, and wireless/telcom components and systems. Thermal interface materials, AlSiC and other metal matrix and polymer matrix materials, and shielding materials (to the extent that there is cross-over with thermal issues) will be discussed here.
Market drivers and economics: abstracts are invited for this new session, intended to combine discussion of technical challenges and drivers with perspectives on market segment size, cost drivers, and performance and reliability requirements. Excellence in design must include and is dependent upon cost and practical assembly considerations.
System-level and component-level integrated EMI and thermal management solutions: papers will be considered in these areas as space allows:
Characterization of thermal solutions, employing computational fluid dynamics (CFD) and other software tools to demonstrate problem definition and tools employed to achieve a working solution at either the component or the system level.
Characterization of thermal solutions utilizing infra-red imaging and other scanning and physical testing tools.
Preparation of abstract
Speakers should submit one copy of a two-paragraph abstract describing their proposed 25-minute presentation no later than 15 January 2001. No formal technical papers are published for these forums to encourage presentation of current development activities. However, a reproduction-ready two- to six-page concise summary with text (figures and graphs included if necessary) will be required for the abstract booklet that will be distributed to attendees only. Abstracts should be submitted to one of the following: firstname.lastname@example.org
Please contact any of the Chairs for more information/questions: