Keywords
Citation
Nihal Sinnadurai, P. (2001), "IMAPS Europe", Microelectronics International, Vol. 18 No. 1. https://doi.org/10.1108/mi.2001.21818aab.001
Publisher
:Emerald Group Publishing Limited
Copyright © 2001, MCB UP Limited
IMAPS Europe
IMAPS Europe
Keywords: IMAPS, Conferences
13th European Microelectronics and Packaging Conference
The 13th European Microelectronics and Packaging Conference and Exhibition will be held at the Palais de la Musique et des Congrès de Strasbourg – France, 30, 31 May and 1 June 2001, Strasbourg, France.
This year it will be organized by IMAPS France jointly with the Benelux and German societies.
General chair: Yves Le Goff Thomson-CSF Detexis.
Technical Programme chair: Jean Claude Rames, Matra BAe Dynamics.
Topic areas:
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Automotive electronic.
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Chip scale package.
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Design, modelling, simulation.
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Environmentally compatible electronics.
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Flip chip.
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High density packaging.
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Integrated passives.
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Laser processing.
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Low cost production.
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Management and marketing.
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Manufacturing technologies.
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Materials.
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Medical electronics.
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MEMS packaging.
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Microwave packaging.
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Mobile electronics.
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Optoelectronics.
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Power packaging.
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Printed wiring boards.
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Quality, reliability.
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Soldering/welding/brazing.
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Surface mount technology.
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Thermal management.
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Wireless packaging.
Microelectronics International will publish the full conference programme in our May 2001 issue of the journal.