Loctite introduces thermal shock resistant epoxy potting compound

Microelectronics International

ISSN: 1356-5362

Publication date: 1 December 2000

Abstract

Keywords

Citation

(2000), "Loctite introduces thermal shock resistant epoxy potting compound", Microelectronics International, Vol. 17 No. 3. https://doi.org/10.1108/mi.2000.21817cad.014

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Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited

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