12 Micron, 3 Sigma repeatability now available from Quad; Quad debuts enhanced small die handling option for APS-1 and APS-1H

Citation

(2000), "12 Micron, 3 Sigma repeatability now available from Quad; Quad debuts enhanced small die handling option for APS-1 and APS-1H", Microelectronics International, Vol. 17 No. 3. https://doi.org/10.1108/mi.2000.21817cad.007

12 Micron, 3 Sigma repeatability now available from Quad; Quad debuts enhanced small die handling option for APS-1 and APS-1H

12 Micron, 3 Sigma repeatability now available from Quad; Quad debuts enhanced small die handling option for APS-1 and APS-1H

Keywords Quad systems, Dies, Handling, Flip chip

Quad Systems Corporation has improved the placement process capability of its APS-1 and APS-1H Advanced Packaging Systems. The new specification is ±12 microns (±0.0005") @ 3 sigma repeatability. This represents a substantial improvement in the ability of the APS Series to place today's finest pitch flip chips. The APS-1 is used in manufacturing operations for precision attachment of die or flip chips to a substrate. The APS-1H is tailored to meet the unique assembly needs of the hybrid market.

Quad also announced that it has begun shipping a new, high-efficiency small die handling option for the APS-1 and APS-1H. This option consists of specialized tooling and advanced algorithms for small die presented on Foton-style grip rings or standard film frames. Enhanced algorithms compensate for pick-up tool run-out and ensure that the tool tip is precisely centered over each small die. APS Series users can now process die down to 0.2mm (0.008") at the highest possible yields.

For further informationm visit: www.quad-sys.com