TY  - JOUR
AB  - 
VL  - 17
IS  - 3
SN  - 1356-5362
DO  - 10.1108/mi.2000.21817cab.013
UR  - https://doi.org/10.1108/mi.2000.21817cab.013
PY  - 2000
Y1  - 2000/01/01
TI  - AMKOR expands stacked chip-scale package capacity and 3D packaging family
T2  - Microelectronics International
PB  - Emerald Group Publishing Limited
Y2  - 2024/04/18
ER  -