AMKOR expands stacked chip-scale package capacity and 3D packaging family

Microelectronics International

ISSN: 1356-5362

Publication date: 1 December 2000

Abstract

Keywords

Citation

(2000), "AMKOR expands stacked chip-scale package capacity and 3D packaging family", Microelectronics International, Vol. 17 No. 3. https://doi.org/10.1108/mi.2000.21817cab.013

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Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited

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