TY  - JOUR
AB  - 
VL  - 17
IS  - 3
SN  - 1356-5362
DO  - 10.1108/mi.2000.21817cab.010
UR  - https://doi.org/10.1108/mi.2000.21817cab.010
PY  - 2000
Y1  - 2000/01/01
TI  - Atmel and CS2 agree to develop interconnect technology for multi-element integration
T2  - Microelectronics International
PB  - Emerald Group Publishing Limited
Y2  - 2024/04/25
ER  -