Hot" packaging issues prompts IMAPS call for papers for international advanced packaging symposium

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 December 2000

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Keywords

Citation

(2000), "Hot" packaging issues prompts IMAPS call for papers for international advanced packaging symposium", Microelectronics International, Vol. 17 No. 3. https://doi.org/10.1108/mi.2000.21817cab.004

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Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


"Hot" packaging issues prompts IMAPS call for papers for international advanced packaging symposium

"Hot" packaging issues prompts IMAPS call for papers for international advanced packaging symposium

Keywords IMAPS, Packaging

IMAPS has announced a Call for Papers for its "International symposium on advanced packaging materials: processing, properties and interfaces", to be held March 11-14, 2001, at Chateau Elan, Braselton, Georgia. Sessions have been tentatively scheduled to address a number of critical and current topics that will include, but are not limited to, Adhesives; Bumping Materials & Processing; Consumer Electronic Material Issues (Cellular Phones); Integral Passive Materials; Interfacial Adhesion; Manufacturing Process Control; Mechanics of Materials; Microwave Materials; On-chip Interconnect Materials; Optoelectronics Substrates; HEI & Dielectrics; Thermal Management Materials; and Underfills & Encapsulant Materials.

The Symposium is sponsored by IMAPS, IEEE Components, Packaging and Manufacturing Technology Society; and the Packaging Research Center (PRC), Georgia Institute of Technology. Other participating Societies include the American Society of Metals, The American Ceramic Society, Society of Plastic Engineers, and the Materials Research Society. Prospective speakers should have submited their 200-word abstract electronically by September 1, 2000, the abstract deadline, to Materials 2K, c/o IMAPS Program Management, abstracts@imaps.org. Faxes would not be accepted.

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