(2000), "SEC expands Web site", Microelectronics International, Vol. 17 No. 2. https://doi.org/10.1108/mi.2000.21817bag.001
Emerald Group Publishing Limited
Copyright © 2000, MCB UP Limited
SEC expands Web site
Keywords Semiconductor Equipment Corporation, Internet
Semiconductor Equipment Corporation has expanded the company's Web site at http://www.semicon.com to include new products such as the multi-use Model 860 OmniTM bonder designed for attaching gold, solder, adhesive, or stud bumped flip chips as well as laser diodes and eutectic die. A variety of new photographs, showing overall product views and close-ups of system features, has been added. Hot links to SEC reps and distributors as well as company background and trade show scheduling, system technical specs and application data are provided.
For more information contact: Lester Salvatierra/SEC. Tel: +1 805-529-2293; Fax: +1 805-529-2193; E-mail: email@example.com; Web site: http://www.semicon.com