SEC expands Web site

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 2000




(2000), "SEC expands Web site", Microelectronics International, Vol. 17 No. 2.



Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited

SEC expands Web site

Keywords Semiconductor Equipment Corporation, Internet

Semiconductor Equipment Corporation has expanded the company's Web site at to include new products such as the multi-use Model 860 OmniTM bonder designed for attaching gold, solder, adhesive, or stud bumped flip chips as well as laser diodes and eutectic die. A variety of new photographs, showing overall product views and close-ups of system features, has been added. Hot links to SEC reps and distributors as well as company background and trade show scheduling, system technical specs and application data are provided.

For more information contact: Lester Salvatierra/SEC. Tel: +1 805-529-2293; Fax: +1 805-529-2193; E-mail:; Web site:

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