Speedier backside silicon thinning for emission imaging

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 2000




(2000), "Speedier backside silicon thinning for emission imaging", Microelectronics International, Vol. 17 No. 2. https://doi.org/10.1108/mi.2000.21817bad.014



Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited

Speedier backside silicon thinning for emission imaging

Keywords Hypervision, Milling

Hypervision has released both software and hardware upgrades to Chip UnZipTM, its popular precision milling system that removes backside silicon to permit backside imaging of chip-level defects in advanced devices:

  • The new Version 2.0 Chip UnZip operating system (Plates 3 and 4) bases all milling functions on MS Windows 98TM. Intuitive icons greatly simplify setup of the automated milling process.

  • A built-in laser now zeros the milling table to permit quicker setup and greater dimensional accuracy.

  • Computer-directed probes provide feedback that guides the milling operation.

Plate 3 Chip UnZip Touch-Off Probe

Plate 4 Chip UnZip Laser Cross-Hair of BGA

Chip UnZip has become the standard method for back-thinning both packaged devices and wafers to as little as 80 microns of remaining silicon without damage. BGAs, TBGAs, flip chips, LOCs and devices having Au- or Al-coated die faces can be imaged for defect localization from the backside with this technique.

For more information, contact Daniel T. Hurley, Chief Marketing Officer, Hypervision Inc., 46560 Fremont Blvd, Suite 415, Fremont CA 94538. Tel: 510 651-7768; Fax: 510 651-1415; E-mail: dhurley@hypervisioninc.com

Related articles