Keywords
Citation
(2000), "Speedier backside silicon thinning for emission imaging", Microelectronics International, Vol. 17 No. 2. https://doi.org/10.1108/mi.2000.21817bad.014
Publisher
:Emerald Group Publishing Limited
Copyright © 2000, MCB UP Limited
Speedier backside silicon thinning for emission imaging
Keywords Hypervision, Milling
Hypervision has released both software and hardware upgrades to Chip UnZipTM, its popular precision milling system that removes backside silicon to permit backside imaging of chip-level defects in advanced devices:
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The new Version 2.0 Chip UnZip operating system (Plates 3 and 4) bases all milling functions on MS Windows 98TM. Intuitive icons greatly simplify setup of the automated milling process.
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A built-in laser now zeros the milling table to permit quicker setup and greater dimensional accuracy.
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Computer-directed probes provide feedback that guides the milling operation.
Plate 3
Chip UnZip Touch-Off Probe
Plate 4
Chip UnZip Laser Cross-Hair of BGA
Chip UnZip has become the standard method for back-thinning both packaged devices and wafers to as little as 80 microns of remaining silicon without damage. BGAs, TBGAs, flip chips, LOCs and devices having Au- or Al-coated die faces can be imaged for defect localization from the backside with this technique.
For more information, contact Daniel T. Hurley, Chief Marketing Officer, Hypervision Inc., 46560 Fremont Blvd, Suite 415, Fremont CA 94538. Tel: 510 651-7768; Fax: 510 651-1415; E-mail: dhurley@hypervisioninc.com