Suss launches new high end production flip chip bonder

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 2000




(2000), "Suss launches new high end production flip chip bonder", Microelectronics International, Vol. 17 No. 2.



Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited

Suss launches new high end production flip chip bonder

Keywords Karl Suss, Flip chip, Bonding

The new FC250 Flip Chip Bonder from Karl Suss made its official market debut on 25 November, as the Fraunhofer Institute (Berlin) took delivery of the first SUSS FC250. Strong market demand for the high end production FC250 is evidenced by three additional new customer orders coming quickly behind the initial Fraunhofer installation. The new equipment at Fraunhofer IZM will complement two flip chip pick and place lines already in use. The FC250 will be used primarily as production process development tool to help industrial partners boost their high-end flip chip applications. Dr Franz Richter, President of SUSS MicroTec will be presenting the new machine on 25 November to the IZM during a concurrent flip chip seminar.

The FC250 is a direct descendant of the highly successful SUSS FC150, the world's first production FC bonder with accuracy routinely achieving 1 micron. The new FC250 offers improved post bond accuracy, throughput of up to 300 bonds per hour and supports a complete range of bonding applications including MCM's, focal plane arrays, laser diodes, chip-on-glass, flat panel displays and more. With features including multi-feed format capability, temperature and force profiling for maximum process flexibility and hands off operation for production environments - the FC250 will target a growing niche in the marketplace.

To learn more about Karl Suss and its full line of products, please visit the Web site at or

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