SEC designs rapid heat head for flip chip bonders

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 2000




(2000), "SEC designs rapid heat head for flip chip bonders", Microelectronics International, Vol. 17 No. 2.



Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited

SEC designs rapid heat head for flip chip bonders

Keywords Semiconductor Equipment Corporation, Flip chip, Bonding

Semiconductor Equipment Corporation has designed a new rapid heat pick-up head for the company's line of flip chip bonders that can be adjusted to either heat the flip chip to a preset temperature or rapidly ramp the temperature at a controlled rate and then hold the temperature for precise periods of time at multiple temperature settings.

The new tool is particularly suitable for thermocompression bonding and will come as a standard feature on SEC's Model 410 flip chip bonder and the company's multi-use Model 860 Omni bonder.

For further information, please contact: Lester Salvatierra/SEC. Tel: 805-529-2293; Fax: 805-529-2193; E-mail:; Web site:

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