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SEC designs rapid heat head for flip chip bonders
Keywords Semiconductor Equipment Corporation, Flip chip, Bonding
Semiconductor Equipment Corporation has designed a new rapid heat pick-up head for the company's line of flip chip bonders that can be adjusted to either heat the flip chip to a preset temperature or rapidly ramp the temperature at a controlled rate and then hold the temperature for precise periods of time at multiple temperature settings.
The new tool is particularly suitable for thermocompression bonding and will come as a standard feature on SEC's Model 410 flip chip bonder and the company's multi-use Model 860 Omni bonder.