Unitive introduces low alpha count flip chip wafer bumping

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 2000




(2000), "Unitive introduces low alpha count flip chip wafer bumping", Microelectronics International, Vol. 17 No. 2. https://doi.org/10.1108/mi.2000.21817bad.004



Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited

Unitive introduces low alpha count flip chip wafer bumping

Keywords Unitive, Flip chip, Bumping

Unitive Advanced Semiconductor Packaging announces the release to manufacturing of a low alpha count flip chip bumping process for both eutectic (63/37) and high-lead (95/5) solder bumps. The process resolves the potential for problems of alpha particles "soft errors" that can occur in integrated circuits with gate dimensions of 0.18 microns and below.

Unitive offers processing for eutectic and high-lead solder with a measured alpha emission rate of 0.01 alphas/hr/cm2, the lowest rate available in the industry from a merchant wafer bumping provider. In contrast, normally occurring lead materials have alpha emission rates of ~ 1 to 100 alphas/hr/cm2.

For more than two decades, the semiconductor industry has been aware that lead (Pb), a material prominent in electronic devices, has radioactive properties which, at some point, could upset the operational reliability of semiconductors. The presence of alpha particle sources in electronic packaging has been known to cause soft errors in integrated circuits.

With the present development of ASIC and other microprocessor circuitry, alpha emissions from lead are now at issue. The continuous move towards smaller gate dimensions (0.18 microns and below) has caused the occurrence of soft errors to become more frequent. Unitive's new process responds to the emerging need for a low alpha flip chip bumping process for flip chip applications.

For further information, please contact: Robert Lanzone. Tel: +919 941 0606 extn: 132; E-mail: rlanzone@unitive.com

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