MRSI introduces advanced technology for eutectic die attach

Microelectronics International

ISSN: 1356-5362

Publication date: 1 August 2000

Keywords

Citation

(2000), "MRSI introduces advanced technology for eutectic die attach", Microelectronics International, Vol. 17 No. 2. https://doi.org/10.1108/mi.2000.21817bad.003

Publisher

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Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


MRSI introduces advanced technology for eutectic die attach

Keywords MRSI, Dies, Eutectic solder

MRSI has introduced the latest technology for eutectic die attach with the MRSI-505 Assembly Work Cell (Plate 1). This flexible system supports direct gold/silicon eutectic and eutectic reflow using gold/tin and gold/germanium preforms. The system uses programmable closed loop temperature control, programmable up to 450°C, for eutectic bonding.

Plate 1 MRSI-505 System

For the process of direct gold silicon eutectic die attach, the MRSI-505 places the die with an inverted pyramid collet and simultaneously scrubs (variable amplitude and frequency) to accomplish eutectic reflow. A heated cover gas of H2 N2 mixture is blanketed over the hot plate.

For gold tin or gold germanium reflow, the system first places a preform onto the package. The die is then scrubbed (variable amplitude and frequency) to accomplish the eutectic reflow. A heated gas cover of H2 N2 mixture is blanketed over the hot plate. The MRSI-505 is the industry leader for ultra precision die placement for epoxy die attach. For more information, contact MRSI at 25 Industrial Avenue, Chelmsford, Massachusetts 01824, USA. Tel: (978) 256-4950, Fax: (978) 256-5120; E-mail: sales@MRSIgroup.com