Super FSF-52 thermal interface material

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 2000

Keywords

Citation

(2000), "Super FSF-52 thermal interface material", Microelectronics International, Vol. 17 No. 2. https://doi.org/10.1108/mi.2000.21817bad.001

Publisher

:

Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


Super FSF-52 thermal interface material

Keywords ORCUS, Film, Heat transfer

ORCUS Inc. has announed the immediate availability of Super FSF-52 Free Standing Film, the latest addition to the Thermaphase line of thermal interface materials. The new material has very low thermal resistance at low closure force. It is the first material on the market suitable for use with the newer, faster, hotter microprocessors. Thermal resistance at 20psi is only 0.015 C/W/in2. This low thermal resistance makes it possible for the thermal designer to achieve compact, efficient cooling in a smaller volume. FSF-52 Super Thermaphase is dry-to-the-touch, easy to handle film at room temperature. It is used as a thermal interface between microprocessors and power components and heat sinks to enhance heat transfer. On initial heat-up by component operation the material phase changes to an easily deformable state and under low pressure it flows to form a short, efficient thermal path between component and heat sink.

Excess material is non-flowing, non-migrating and forms a seal around the perimeter of the component. For more information contact ORCUS Inc., Tel: 913-438-9976; Fax: 913-438-7180; E-mail: orcususa@ix.netcom.com