Kulicke & Soffa and Amkor Technology announce flip chip technologies license

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 2000

Keywords

Citation

(2000), "Kulicke & Soffa and Amkor Technology announce flip chip technologies license", Microelectronics International, Vol. 17 No. 2. https://doi.org/10.1108/mi.2000.21817bab.006

Publisher

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Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


Kulicke & Soffa and Amkor Technology announce flip chip technologies license

Keywords Kulicke & Soffa, Amkor Technology, Flip chip, Electronics industry

Kulicke & Soffa Industries, Inc. and Amkor Technology, Inc. have announced a ten-year technology transfer agreement between Amkor and Flip Chip Technologies, LLC (FCT).

Amkor will use FCT's proprietary flex-on-cap (FOC) wafer bumping and redistribution (RDL) technologies to manufacture advanced flip chip IC packages for both performance and form factor driven applications. Amkor currently outsources wafer bumping for high-performance flip chip packages through FCT's Phoenix-based facilities. Amkor plans to add wafer bumping capability in its Korean manufacturing factory in response to growing demand for flip chip packages.

The key elements of the technology transfer agreement will provide Amkor with future technology development, second sourcing, redistribution capability, and opportunities for cost and cycle time reduction by locating bump manufacturing close to the assembly and test production lines.

Amkor selected FCT's FOC and RDL processes due to their proven track record with leading customers. This technology is the leading commercial solder bumping solution. Other advantages of the FCT solder paste deposition process include: control of the solder composition, "low alpha" processing, and its inherent extendibility to "lead-free" as well as 300 mm solutions. Outside of conventional bumping applications, the combination of RDL and FOC also enables certain wafer level CSP options for customers.