Amkor to install wafer bumping capability to support growing demand for flip chip packaging

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 2000

Keywords

Citation

(2000), "Amkor to install wafer bumping capability to support growing demand for flip chip packaging", Microelectronics International, Vol. 17 No. 2. https://doi.org/10.1108/mi.2000.21817bab.005

Publisher

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Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


Amkor to install wafer bumping capability to support growing demand for flip chip packaging

Keywords Amkor Technology, Bumping, Flip chip, Packaging

Amkor Technology, Inc. has announced plans to add wafer bumping capabilities at its Korean manufacturing plant by the end of 2000 in support of growing demand for flip chip packaging. Flip chip packaging is an alternative die connection technology that replaces today's mainstream wire bonding technology. The wafer bumping process adds conductive interconnects to the silicon die pads eliminating the need for wirebonding and providing improved performance through a much shorter interconnection path.

Driving the growth in flip chip packaging is increasing demand for high performance handheld applications such as RF wireless communications and high-speed network systems. Flip chip die accounts for 1.5 per cent of the 60 billion IC circuits produced worldwide, but is expected to grow at an annual compound rate of 48 per cent per year over the next few years. The adoption rate is even higher for the chip scale package (CSP) market segment where flip chip is forecasted to grow from 5 per cent of all CSP in 1998 to 25 per cent by 2003 (source: Prismark Partners).

"Adding our own internal solder bumping capability will enhance Amkor's growing support for flip chip packages and complements our earlier joint-technology agreements with LSI Logic and Flip Chip Technology", said Richard Groover, Amkor vice president and chief technologist for flip chip technology. "Additionally, since the lion's share of silicon being produced today is still designed for wire bond packaging, we will be offering repassivation and redistribution (the relocation of die bond pads to optimum locations). The internal flip chip bump process enables Amkor to participate actively in the arena for direct chip attach, wafer scale package, and integrated passive device. These new and exciting applications are already demonstrating huge demand, especially with our wireless customers."

The bumping capability provided through this expansion will support large and small sized die applications, future pitch requirements, and both lead-based and lead-free interconnection solutions. Amkor currently supports customers with a flip chip packaging line in its Philippine facilities, and a rapid-prototype flip chip packaging line at its Chandler, Arizona site. A new flip chip packaging line is also planned for Korea. While these facilities already handle a wide range of bump technologies today through outside suppliers, or customers' supplied bumped chips, Amkor's internal bumping capability will put all flip chip operations under Amkor control and provide customers with true turn-key flip chip solutions. This will ensure Amkor controlled cost reduction performance, quality, and a customer-centric technology development roadmap.

"We are developing optimized packages for low, medium, and high lead-count applications, for both cost-driven and performance-driven applications, and we will offer the best available flip chip technologies that have been proven to speed customers' market entry and minimize any reliability concerns and risks", concludes Richard Groover.