Total solutions for the back end from datacon

Citation

(2000), "Total solutions for the back end from datacon", Microelectronics International, Vol. 17 No. 1. https://doi.org/10.1108/mi.2000.21817aad.012

Total solutions for the back end from datacon

Total solutions for the back end from datacon

Keywords: Datacon, Inspection

The new 3D inspection system 8000 enables the analysis of three-dimensional image data for bump, wire, wafer and post-bonding inspections as well as the inspection of glue and solder pastes.

Measurement is made by means of a specially developed 3D laser measuring head over an x-y positioning system. A high degree of flexibility is provided through the "plug and play" feature of all configurable components.

The new 3D inspection system is capable of inspecting 4" to 12" (300mm) wafers, sawed wafers on a wafer frame, as well as substrates and lead frames. The 8000 offers 100 percent inspection of critical process parameters, for example bond line thickness, bond quality, edge and corner fractures, etc. A high degree of reliability and quality assurance is guaranteed throughout the entire process sequence.

At Productronica 1999 Datacon introduced its newly developed die sorter. This machine is able to take dice off the wafer and place them in a tape, waffle packs or gel PAK®. The tape is cycled "reel to reel" through the machine by means of a spring-loaded, sensor-monitored and pneumatically liftable cog wheel. Positioning is made by a step motor.

The absence of components in the tape is determined by a sensor on the pick and place unit. The 2210 ds has multi-chip capability and has all the standard features of the successful Datacon die bonders, namely wafer changing, tool changing, multi-chip ejector system, etc. The integration of Datacon flip-chip technology is also possible. Furthermore, the machine is equipped with a width adjustable sealing unit that supports hot and cold sealing, and plug and play capability for all configurable components.