Radiant technology unveils new wafer bump reflow oven

Microelectronics International

ISSN: 1356-5362

Publication date: 1 April 2000

Keywords

Citation

(2000), "Radiant technology unveils new wafer bump reflow oven", Microelectronics International, Vol. 17 No. 1. https://doi.org/10.1108/mi.2000.21817aad.011

Publisher

:

Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


Radiant technology unveils new wafer bump reflow oven

Radiant technology unveils new wafer bump reflow oven

Keywords: Radiant Technology, Ovens, Reflow

Radiant Technology Corporation has introduced a new Continuous Conduction Wafer Bump Reflow Oven. The oven provides a state-of-the-art means for the Semiconductor Packaging Industry to prepare microchips for attachment to an electronic assembly.

RTC's new HotBelt™ conduction oven has all the advantages of hot plate reflow systems, but eliminates the disadvantages of these systems while providing the benefits of traditional controlled atmosphere ovens and furnaces.

Customers in the microelectronics industry have indicated their preference for conduction heating because it offers efficiency and simplifies the task of thermal profiling. With conduction heating, wafers are guaranteed to be at the correct process temperature as the set point zone temperature and the wafer process temperature are the same. However, they cite major concerns with systems commercially available today. These problems include: hot plates are too slow to heat up and cool down (several hours), causing a loss of production time; wafers need to be pushed from stage to stage, causing misalignment with downstream wafer handling systems; residue accumulates on the hot plates, causing the wafers to become contaminated; and, hot plate systems do not provide the necessary controlled atmosphere containing less than five parts per million oxygen molecules.

Radiant Technology's new wafer bump reflow system, WB-Series, claims to solve all these problems. It features three separate conveyor belts to transport the wafers through the reflow oven, eliminating the need for the wafers to be pushed from station to station. Also, the product has a flux management system, eliminating the need to stop production to clean accumulated flux residue.

For further details contact: C.T. Richert. Tel: +1 714 991 0200; Website: http://www.radianttech. com