Keywords
Citation
(2000), "Conductive film for MR/GMR head wafer fab", Microelectronics International, Vol. 17 No. 1. https://doi.org/10.1108/mi.2000.21817aad.007
Publisher
:Emerald Group Publishing Limited
Copyright © 2000, MCB UP Limited
Conductive film for MR/GMR head wafer fab
Conductive film for MR/GMR head wafer fab
Keywords: Ablestik, Adhesives, Thermoplastics
Ablestik Laboratories introduces a new thermoplastic adhesive film designed to provide temporary attach for MR or GMR head wafer fabrication. ABLEFILM™ WF5802E electrically conductive adhesive provides electrostatic discharge (ESD) protection during ion milling and reactive etching of MR and GMR heads. WF5802E significantly reduces yield loss due to ESD during wafer lab. WF5802E is reportedly easily and completely removed with the use of safe solvents.
For further details contact: Ablestik. Tel: +1 310-764 4600; Fax: +1 310 764 2545; E-mail: jilla.senkbeil@nstarch.com; WWW: http://www.ablestik.com