Conductive film for MR/GMR head wafer fab

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 2000




(2000), "Conductive film for MR/GMR head wafer fab", Microelectronics International, Vol. 17 No. 1.



Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited

Conductive film for MR/GMR head wafer fab

Conductive film for MR/GMR head wafer fab

Keywords: Ablestik, Adhesives, Thermoplastics

Ablestik Laboratories introduces a new thermoplastic adhesive film designed to provide temporary attach for MR or GMR head wafer fabrication. ABLEFILMâ„¢ WF5802E electrically conductive adhesive provides electrostatic discharge (ESD) protection during ion milling and reactive etching of MR and GMR heads. WF5802E significantly reduces yield loss due to ESD during wafer lab. WF5802E is reportedly easily and completely removed with the use of safe solvents.

For further details contact: Ablestik. Tel: +1 310-764 4600; Fax: +1 310 764 2545; E-mail:; WWW:

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