IMAPS and Miller Freeman announce launch of HD International

Microelectronics International

ISSN: 1356-5362

Publication date: 1 April 2000

Citation

(2000), "IMAPS and Miller Freeman announce launch of HD International", Microelectronics International, Vol. 17 No. 1. https://doi.org/10.1108/mi.2000.21817aac.002

Publisher

:

Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited


IMAPS and Miller Freeman announce launch of HD International

IMAPS and Miller Freeman announce launch of HD International

Miller Freeman and the International Microelectronics and Packaging Society (IMAPS) have announced the launch of HD International (High Density International), an international conference and trade show on high-density interconnect and systems packaging. The event, sponsored by IMAPS and Miller Freeman, will focus on issues surrounding the growing market for smaller and more powerful electronic equipment and will present solutions-oriented sessions on the application of high-density packaging.

HD International will be held 26-28 April 2000, at the Adams Mark Hotel in Denver, Colorado. It replaces the previous HDP/MCM Denver and ISPS San Diego conferences produced by IMAPS. "HD International is the next evolution of high-density interconnect and systems microelectronics of the Denver conference", said Jim Cook, president of IMAPS. "This partnership will allow us to provide attendees with solutions that enable product realization and improvement through the application of high-density packaging and system integration technologies".

The event will be comprised of a technical conference and an exposition. The conference programme will focus on approximately 15 broad topics from die-level test, assembly and packaging to high-density printed wiring boards and substrates to systems-level issues. Individual sessions will cover application requirements, technology capabilities, design and processes. The exposition will showcase the latest technologies and services from over 100 leading-edge companies.