Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 2000




(2000), "IMAPS USA", Microelectronics International, Vol. 17 No. 1.



Emerald Group Publishing Limited

Copyright © 2000, MCB UP Limited



Keywords: IMAPS, USA

CII's ceramic industry roadmap addresses electronic packaging issue

The Ceramic Interconnect Initiative (CII) of IMAPS provides a ten-year ceramic industry "roadmap", a document that describes how the features of ceramic technology deliver benefits for a wide variety of electronic packaging and interconnect applications. The roadmap analyzes the current state and forecasts future requirements of the use of ceramic in electronic packaging.

The purpose of the roadmap is to demonstrate the competitive advantages of ceramic technologies and their potential uses in the design, development, manufacturing and marketing of microelectronics applications over the next decade. It is intended to serve as a reference document to guide investment in research, development, and deployment for the ceramic technology infrastructure. Copies of the roadmap are available by contacting the National Electronics Manufacturing Initiative (NEMI) at or the IPC at

Van Loan outlines plans for IMAPS for year 2000

IMAPS 2000 President, has announced his goals for the Society in the next year. Building upon the Three-Year Strategic Plan implemented by 1999 President Jim Cook, Van Loan has affirmed the IMAPS Vision Statement: "IMAPS will be a leader in providing technical interaction and education in the microelectronics industry."

"In achieving our goals in pursuit of this vision", stated Van Loan, "we shall be guided by three principles":

  1. 1.

    continuous improvement of value to our membership;

  2. 2.

    increased industry effectiveness;

  3. 3.

    financial responsibility.

"I have had the opportunity to attend several local Chapter Symposia and I am convinced that the energy, innovation, and focus necessary to maintain and increase the relevance of IMAPS to its members and the electronics community at large are in good supply among the volunteer officials and the staff."

IMAPS professional development course going online

IMAPS is going online with the first of one of its popular Professional Development Courses (PDC). Historically, PDCs have been given as part of the annual International Microelectronics Symposium and have been a favourite of attendees for several years.

IMAPS launched this first online professional development course 1 January 2000. Dr Jerry E. Sergent presented "Introduction to Hybrid Microelectronics" in a ten-hour interactive, Web-based course. Audio, video, and discussion forums are among the many features of the site constructed by The Gain Company, a Web site development firm located in Canandaigua, NY. Internet training offers an alternative to classroom training for those who require a flexible learning schedule without sacrificing presentation quality, course content, or interaction with their peers and instructor.

IMAPS unveils the "Microelectronics Portal to the 21st Century" at IMAPS '99

IMAPS presented its new Web site ( at IMAPS '99. Ron Baldan, Vice President of Information Dissemination and the main force in development of the new Web site, stated, "for the last year, in addition to a new bright design of the IMAPS Web site, we have added online access to both Advancing Microelectronics magazine and the International Journal of Microcircuits and Electronic Packaging publications, the Virtual Trade Show and information on all our domestic and international chapters." The current design team will have online in the first quarter of 2000 Microelectronic Industry Products and Services, a searchable database of members, products and services much like the former Industry Guide. Discussion Forums on topics pertinent to our core technologies will soon follow. Other items on the list include full Web site text search capability and an enhanced Jobs Marketplace with on-line resumes allowing both job seekers and companies looking for microelectronics professionals to search the databases by job type and geographic location. The new IMAPS Web site will truly be the "Microelectronics Portal to the 21st Century."

Ceramic Interconnect technology poised for explosive growth

The twenty-first century will be full of opportunity for Ceramic Interconnect technology. Ceramics are poised to play a huge role in growth areas such as wireless communications, automotive electronics, fibre optics and sensors. This was according to a first-ever panel of Ceramic Interconnect technology experts who recently convened at the 32nd International Microelectronics and Packaging Society Symposium (IMAPS '99) in Chicago, USA.

The Ceramic Technology Panel addressed topics such as advances in materials and packaging technology, new applications utilizing ceramic and trends in the ceramic interconnect industry. Sam Horowitz, chairman of the Ceramic Interconnect Initiative, hosted the panel, which consisted of representatives from various levels of the ceramic technology industry supply chain, including material suppliers, substrate manufacturers, circuit manufacturers and system suppliers. Members of the electronics industry trade media, clearly intrigued by the ceramic's potential and eager for more information about the technology, were also in attendance.

Highlights of the panel's discussion included:

  • Ceramic interconnection technologies are continuously improving to meet changing market requirements. No longer used solely in military and aerospace applications, ceramic technology has evolved with the times. Today, advanced ceramic technology is the technology of choice for a new generation of designers. It is an ideal solution for many of today's most popular consumer devices, including cell phones, pagers, anti-lock braking systems and automotive engine controllers.

  • Packaging and system designers have begun to fully appreciate the benefits and capabilities of ceramic technology, which include the ability to integrate passive components and functions into substrates, reduce costs, improve reliability and faster time to market.

  • Ceramic technology is well-positioned to meet the demands of wireless designers, and will play a critical role in the future of wireless communications.

An updated ceramic industry roadmap will be available from IMAPS by the end of March 2000. The roadmap demonstrates the competitive advantages of ceramic technologies and their potential uses in the design, development, manufacturing and marketing of microelectronics applications over the next decade.

Related articles