TY  - JOUR
AB  - 
VL  - 17
IS  - 2
SN  - 1356-5362
DO  - 10.1108/mi.2000.17.2.34.2
UR  - https://doi.org/10.1108/mi.2000.17.2.34.2
AU  - Kingsley David
PY  - 2000
Y1  - 2000/01/01
TI  - An Engineer’s Handbook of Encapsulation and Underfill Technology
T2  - Microelectronics International
PB  - Emerald Group Publishing Limited
SP  - 34
EP  - 35
Y2  - 2024/04/16
ER  -