To read the full version of this content please select one of the options below:

An Engineer’s Handbook of Encapsulation and Underfill Technology

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 2000

Downloads

56

Keywords

Citation

Kingsley, D. (2000), "An Engineer’s Handbook of Encapsulation and Underfill Technology", Microelectronics International, Vol. 17 No. 2, pp. 34-35. https://doi.org/10.1108/mi.2000.17.2.34.2

Publisher

:

Emerald Group Publishing Limited

Related articles