Du Pont launches new gold conductor QG150 for high density/high frequency applications

Citation

(1999), "Du Pont launches new gold conductor QG150 for high density/high frequency applications", Microelectronics International, Vol. 16 No. 3. https://doi.org/10.1108/mi.1999.21816cad.018

Du Pont launches new gold conductor QG150 for high density/high frequency applications

Du Pont launches new gold conductor QG150 for high density/high frequency applications

Keywords DuPont, Conductor

Du Pont Electronic Materials launched a new high-density thick film gold conductor QG150 (Plate 7). Designed for interconnect applications requiring ultra-fine line resolution or superior performance at high frequency, QG150 is compatible with a wide range of ceramic substrates and thick film multilayer dielectrics. It provides a low cost alternative to thin film metallisations, for both high density interconnect and RF/microwave applications, including cellular phones, satellite communications and local multipoint distribution systems (LMDS).

Du Pont gold conductor QG150 has excellent edge definition, providing low loss at frequencies above 20GHz. Capable of being etched to resolve features smaller than 25 microns, this high-density gold conductor uses new gold powder technology, yielding powders with controlled surface morphology and average particle size in the sub-micron range. QG150 also incorporates a new inorganic binder system, which in combination with the sub-micron metal powders, optimises sintering density and wirebond strength, providing compatibility with a wide variety of substrates and dielectrics.

A study presented at the recent 1998 International Conference on Multichip Modules, in Denver, Colorado, showed that QG150 patterned on 96 per cent alumina substrates has high frequency performance (attenuation) equivalent to that of thin film on more costly 99 per cent alumina substrates. These studies used a 50ohm "T-pattern" microstrip resonator pattern for high frequency testing.

Plate 7QG 150 gold conductor has shown excellent performance during high speed bonding operation