New adhesive films from Ablestik

Citation

(1999), "New adhesive films from Ablestik", Microelectronics International, Vol. 16 No. 3. https://doi.org/10.1108/mi.1999.21816cad.017

New adhesive films from Ablestik

New adhesive films from Ablestik

Keywords Ablestik, Adhesives

Ablestik introduces Ableflex series adhesives, a new line of materials designed for high reliability, semiconductor die attach applications. These nonconductive adhesive films feature rapid film pre-attach to substrate, low attach temperature, rapid die attach, low stress, and high thermal stability. Ableflex adhesives are ideal for the latest generation chip scale packages (CSP).

Ableflex 5203 series adhesive films have a thin layer of high purity, thermoset adhesive coated onto both sides of a high Tg polyimide carrier. The polyimide carrier maintains electrical isolation between bonded surfaces, while the adhesive provides excellent mechanical strength. These adhesive films are suitable for bonding silicon die to laminate or flex based CSPs.

Ableflex 5203 series adhesive films are tailored for high speed assembly operations where the adhesive is first pre-attached to a substrate, then moved to a die attach operation, and finally cured. The adhesive exhibits an optimized modulus that allows for stress relief and the ability to perform subsequent thermal operations, such as wire bonding.

For more information on these materials contact Ablestik. Tel: +1 (310) 764 4600; Fax: +1 (310) 764 2545; Web: http://www.ablestik.com