Speedline Technologies Asia launches small footprint, high performance semiconductor cleaning system

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 December 1999

Keywords

Citation

(1999), "Speedline Technologies Asia launches small footprint, high performance semiconductor cleaning system", Microelectronics International, Vol. 16 No. 3. https://doi.org/10.1108/mi.1999.21816cad.015

Publisher

:

Emerald Group Publishing Limited

Copyright © 1999, MCB UP Limited


Speedline Technologies Asia launches small footprint, high performance semiconductor cleaning system

Speedline Technologies Asia launches small footprint, high performance semiconductor cleaning system

Keywords Speedline, Cleaning, Semiconductors

Speedline Technologies Asia has launched the Microline Automatic Inline Cleaning System, a high performance semiconductor cleaning system with one of the smallest footprints in the industry.

A compact, fully automatic in-line cleaner designed for semi-aqueous and aqueous electronic circuit cleaning, Microline is part of the Speedline ACCEL range of advanced semiconductor cleaning systems. Featuring SMEMA and SEMI S2-93 compliance, integral rinse water recycling, and stainless steel construction, the Microline cleans BGA strips, MCMs, small modules, singulated devices, and parts mounted on trays, pallets, or boats for processing.

Using a segmented belt design and new integrated flow modules to provide 100 per cent removal of contaminants, high throughput, and complete rinsing and total drying, the Microline's closed-loop operation leads to lower materials consumption. With a footprint of only 84 × 50 inches, the Microline is one of the industry's smallest in-line cleaners.

The world-leading ACCEL range of precision semiconductor cleaning systems is available from Speedline Technologies Asia, part of Cookson Singapore Pte Ltd. Tel: +65 286 6635.