Unique BGA reballing solution from Intertronics

Citation

(1999), "Unique BGA reballing solution from Intertronics", Microelectronics International, Vol. 16 No. 3. https://doi.org/10.1108/mi.1999.21816cad.011

Unique BGA reballing solution from Intertronics

Unique BGA reballing solution from Intertronics

Keywords Intertronics, Ball grid array

SolderQuik™ BGA from Intertronics, is a unique solution to low to medium volume reballing of ball grid array components ­ eliminating the need for stencils, loose solder balls and solder paste in the reballing process. SolderQuik BGA has become the undisputed choice among leading US semiconductor and board assembly manufacturers.

There are a number of automated solder ball dispensing machines on the market for high volume ball attach. Both the machines and the tooling generally involve substantial investment, and are applicable for only one specific package type. They do not therefore provide a viable solution to placing an array of solder spheres on a few, or even a few thousand components.

The SolderQuik BGA preform consists of an array of solder spheres embedded in a water soluble paper/polymer carrier. All that is required is the application of flux and alignment of the component to the preform with an inexpensive fixture. After reflow, the carrier is moistened and peeled off.

Reballing a component with SolderQuik BGA requires only a few seconds' work and minimal operator skill. The process works very well with most reflow equipment and alongside any rework station. Preforms are currently available in over 160 array patterns, including various ball sizes and centre cut designs (for cavity-down components). The pattern database is being continually enlarged to meet customer demand.

SolderQuik BGA is also ideal for initial attach, such as prototyping or small volume production runs, as well as rework.

Standard fixtures are available for package sizes from 21mm × 21mm to 37.5mm × 37.5mm and as a flexible fixture.

BGA reball starter kit

A SolderQuik BGA reball starter kit is available from Intertronics for very low volume or evaluation purposes.

For further information contact Peter Swanson at Intertronics. Tel: +44 (0) 1865 842842.