NPL improves reliability and performance of microelectronics encapsulants

Citation

(1999), "NPL improves reliability and performance of microelectronics encapsulants", Microelectronics International, Vol. 16 No. 3. https://doi.org/10.1108/mi.1999.21816cab.012

NPL improves reliability and performance of microelectronics encapsulants

NPL improves reliability and performance of microelectronics encapsulants

Keywords NPL, Encapsulant materials

NPL is developing measurement methods for quantifying the protective behaviour of microelectronic encapsulant materials, enabling the industry to improve the reliability and performance of its products.

Assessing the performance and reliability of conformal coatings and glob-top encapsulants is now a major issue for the microelectronics industry. Under the DTI's Degradation of Materials in Aggressive Environments programme, the project, which has been formulated in close collaboration with the industry, will address two key aspects of encapsulant performance and reliability:

1. 1.

   moisture permeability of the encapsulant materials;

2. 2.

   adhesion of the encapsulant materials to the board and components.

The work at NPL will develop new test methods for quantifying these two important parameters, to enable the industry to make informed and appropriate choices of materials for particular applications. There is a high level of support for the project from within the industry, with participation from over ten companies representing materials and equipment suppliers, instrument manufacturers and microelectronics assemblers.

The project, which began last year, will deliver the first results on a new method for measuring the moisture permeability of conformal coating materials in Autumn 1999.

For further details of the project please contact: Dr Carl Levoguer, National Physical Laboratory, Teddington, Middlesex TW11 0LW. Tel: +44 (0) 181 943 6263; Fax: +44 (0) 181 943 6453; E-mail: carl.levoguer@npl.co.uk