Keywords
Citation
(1999), "VIA electronic GmbH and SOREP-ERULEC S. A. form strategic alliance", Microelectronics International, Vol. 16 No. 3. https://doi.org/10.1108/mi.1999.21816cab.009
Publisher
:Emerald Group Publishing Limited
Copyright © 1999, MCB UP Limited
VIA electronic GmbH and SOREP-ERULEC S. A. form strategic alliance
VIA electronic GmbH and SOREP-ERULEC S. A. form strategic alliance
Keywords Via electronic, SOREP-ERULEC
In a bid to strengthen LTCC technology in Europe, SOREP-ERULEC and VIA electronic have formed a strategic partnership. The two companies have compatible design tools and manufacturing and a common understanding of LTCC and related technologies. The cooperation will allow sharing and optimisation of R&D efforts, manufacturing capabilities and market strategies.
The contract was signed at the end of February 1999, leading to a significant participation of SOREP-ERULEC in VIA shareholding. This contract is considered to be the first step towards a long term cooperation to reinforce both companies' position in the LTCC field in Europe and worldwide.