IMAPS Nordic

IMAPS Nordic

IMAPS Nordic

Keywords IMAPS, Nordic

36th Annual Conference ­ conference programme

Sunday 19 September 1999

Tutorials:

08.30-12.30 E. Jan Vardaman, TechSearch International, USA ­ "Area array packages trends and applications: CSPs and BGAs".

13.30-17.30 Dr Elke Zakel, PacTech GmbH, Germany ­ "Flip chip technology".

08.30-17.30 Michael Pecht, Calce, U. of Maryland ­ "How to select and use electronic parts outside the manufacturer-specified temperature range".

Monday 20 September 1999

09.00-09.30 IMAPS Nordic Annual Meeting, Paul Collander.

09.30-10.30 Opening Session, Paul Collander.

09.30-09.35 Paul Collander, IMAPS Nordic President, Nokia Research Center, Finland ­ Opening.

09.35-10.00 Heikki Huomo, VP R&T, Nokia Mobile Phones, Finland ­ Keynote speech: "Packaging and interconnect getting a revenge".

10.00-10.30 Exhibitors ­ A run through the technical importance of what is on display in the exhibition.

10.30-11.00 Coffee and exhibition.

M1

11.00-12.30 High volume production, Sören Nörlyng, Katarina Boustedt.

E. Jan Vardaman, TechSearch International, USA ­ "A market and technology analysis of high density substrates for IC packages".

Moses Chan CS2, Belgium ­ "Effects of package construction on thermal performance of BT based ball grid array packages".

Kari Määttänen, Jouko Happonen and Aulis Tuominen, Nokia Display Products, Nokia Mobile Phones, Pori University, Finland ­"The size evolvement of LCD displays by packaging technology means".

12.30-13.30 Lunch.

M2

13.30-15.00 Integrated passives ­ Paul Collander, Ivan Szendiuch.

Shaofang Gong, Björn Ekstrom, Johan Nilsson, Magnus Hörlin Olle-Jonny Hagel, IMC, Sweden ­ "Evaluation of passive components and devices integrated in MCM-L and MCM-D substrates".

Robert Heistand II, David Liu, R. Moffatt Kennedy, George Korony, Joe Hock, Andy Ritter, AVX, USA ­ "Advances in passive integrationfor C/RC arrays and networkswith novel thin and thick film materials".

S. Wijeyesekera, N. Patel, D.H. Bolton, P. Chang, H.M. Clearfield, Intarsia Corp., USA ­ "Development of wafer level packaging for integrated passive devices".

15.00-16.00 Coffee and exhibition.

M3

16.00 - 18.00 RF and millimeter wave ­ Hans Danielsson, Henrik Hvims.

Philip Pieters, Walter DeRaedt, Eric Beyne, IMEC, Belgium ­ "Advances in microwave MCM-D technology".

Peter Barnwell, Heraeus Inc., Cermalloy Division, UK/USA ­ "A new, very low loss LTCC technology, combined with photo-patterned thick film for microwave applications".

Martin Oppermann, DaimlerChrysler Aerospace AG, Germany ­ "Millimeter-wave modules and applications ­ based on 3D packaging and multichip modules (MCMs)".

Hannu Ronkainen, Tarja Riihisaari, Hannu Kattelus, Arni Kujala, Jyrki Kaitila, VTT Electronics, Helsinki U. of Tech., Finland ­ "MCM-D RF circuit block design".

20.00-23.00 Banquet dinner.

Tuesday 21 September 1999

T1

08.30 - 10.00 FlipChip and fine pitch BGA ­ Katarina Boustedt, Sören Nörlyng.

Jarmo Määttänen, Petteri Palm, Elcoteq Network Corp., Finland ­ "Development of flip chip on flex process using anisotropically conductive adhesives".

Peter Elenius, Jim Leal, Dave Stepniak, Shing Yeh, Flip Chip Technologies, Delphi Delco Electronics, USA ­ "Recent Aadvances in flip chip wafer bumping using solder paste technology".

Simone Peters, Loctite Europe, UK ­ "A roadmap to flip chip assembly using advanced adhesives".

10.00-11.00 Coffee and exhibition.

T2

11.00 - 12.30 Substrates ­ Ivan Szendiuch, Paul Collander

David J.J. Lowrie, Mike G. Firmstone, Martin Bartholomew, Bill Green, Multicore Solders Ltd, ELPAC Inc., UK ­ "The moulded electronic package (MEP)".

Arja Mehtäl, Nokia Research Center, Finland ­ "Future challenges in printed wiring board technology".

A. Wolter, P. Kersten, Photo Print Electronic GmbH, Germany ­ "Advanced microvia substrates for CSP and flip chip mounting".

12.30-13.00 Lunch.

T3

13.30-15.30 MEMS packaging ­ Kenneth Dahlberg, Snorre Prytz.

Matthias Heschel, Peter T. Tang, Jochen F. Kuhmann, Siebe Bouwstra, Kurt Rasmussen, Mikroelektronik Centret, DTU, Microtronic A/S, Denmark ­ "Multiple through-wafer interconnects for stacking of microsystems".

Outi Rusanen, VTT Electronics, Finland ­ "MEMS packaging".

Staffan Karlsson, Stefan Johansson, Katarina Boustedt, Uppsala University, Ericsson Microwave Systems, Sweden ­ "A new flexible building technique for microsystems".

Jon H. Ulvensøen, Grete Lill Karlsen, SensoNor asa, Norway ­ "Packaging for volume production of micro electromechanical Ssystems ­ a great challenge.

15.30-16.30 Coffee and exhibition.

T4

16.30-18.30 Ceramics still going strong ­ Terho Kutilainen, Hans Danielsson.

Heiko Thust, Karl-Heinz Drüe, Torsten Thelemann, Technical University of Ilmenau, Germany ­ "Trimming arrangement of buried resistors in LTCC".

Leon Balents, Herb Dwyer, Zecal Inc., USA ­ "Plated copper on ceramic technology is introduced into RF and CSP packaging".

Hans Danielsson, Mikroelektronik Konsult, Sweden ­ "SMT on ceramic for high reliability".

John Oleksyn, DuPont Electronics, UK ­ "The utilisation of thick film Cu and Ag conductors in power applications".

19.00-21.00 Buffet Dinner in Exhibition area.

Wednesday 22 September 1999

W1

08.00-10.00 Reliability assessment ­ Snorre Prytz, Kenneth Dahlberg.

Dewei Tian, Risto Rautioaho, Seppo Leppävouri, University of Oulu, Finland ­ "Inspection of microelectronics packaging using X-ray and scanning acoustic microscopes".

Esa Muukkonen, Pekka Pirttikoski, Aulis Tuominen, Pori University, Finland ­ "Characterization of creep phenomenon in connection materials in advanced surface".

Horatio Quinones, Asymtek, USA ­ "Reliability statistics for flip chip interconnections".

Virpi Pennanen, Markku Tammenmaa, Tommi Reinikainen, Jiansen Zhu, Wei Lin, Nokia Telecommunications, Nokia Research Center, Finland ­ "Evaluation of TBGA interconnection reliability".

10.00-10.30 Coffee.

W2

10.30-12.00 Reliable organic materials ­ Henrik Hvims, Terho Kutilainen.

Bart Vandevelde, IMEC, Belgium ­ "The polymer stud grid array (PSGA) package".

Petteri Palm, Aulis Tuominen, Elcoteq, Pori University, Finland ­ "The adhesion strength of underfill material to two solder resists in high humidity environment".

Magnus Törnvall, Peter Haglund, Jan-Olof Andersson, Combitech Electronics AB ­ "Reliability of isotropic conductive adhesive joints to different surface and component metallizations in automotive applications".

12.00-12.15 Closing session.

Further information is available from the IMAPS Nordic website: http://www.imapsnordic.a.se