New bond load option adds to flip chip bonder's versatility

Citation

(1999), "New bond load option adds to flip chip bonder's versatility", Microelectronics International, Vol. 16 No. 2. https://doi.org/10.1108/mi.1999.21816bad.015

New bond load option adds to flip chip bonder's versatility

New bond load option adds to flip chip bonder's versatility

Keywords Bonding, Flip chip, Semiconductor Equipment

Semiconductor Equipment Corporation have announced the availability of an optional four-kilogram bond load feature for the company's low cost Model 850 flip chip bonder.

The new option considerably extends the system's bond load capability from its standard 400 grams and complements the company's recently announced hot gas spot heater and heated stage options for added system versatility. The cost of the four-kilogram optional feature is $2,900.