Direct die feeder reduces packaging costs

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 1999




(1999), "Direct die feeder reduces packaging costs", Microelectronics International, Vol. 16 No. 2.



Emerald Group Publishing Limited

Copyright © 1999, MCB UP Limited

Direct die feeder reduces packaging costs

Direct die feeder reduces packaging costs

Keywords Feeders, Zevatech

Zevatech® Inc. has announced the addition of the SMT Vision award-winning Hover-Davis direct die feeder to its 700 Series accessories (Plate 1). The feeder meets the challenges presented by wafer component packaging. This addition to the 700 Series allows bare die and flip chip to be picked directly from four- or eight-inch wafers and presented to the 700 Series pick-and-place machines in only three inches of feeder space.

Since the die or flip chip are delivered direct from the wafer to the machine and taping is eliminated, the manufacturer saves the $0.10 to $0.20 per part associated with moving the chip from wafer to tape or tray. Also, the possibility of damage in handling is significantly lower since the components stay on the wafer until the last possible moment.

Plate 1Zevatech direct die feeder

The direct die feeder presents only known non-inked die to the machine. This feature saves manufacturers the time and money associated with rework.

For more information about the direct die feeder, contact Zevatech at +1 919-460-011 l; by fax at +1 919469-0480; by mail at 507 Airport Boulevard, Morrisville, NC 27560; or on the World Wide Web at

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