Zevatech forms new advanced transfer division

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 1999




(1999), "Zevatech forms new advanced transfer division", Microelectronics International, Vol. 16 No. 2. https://doi.org/10.1108/mi.1999.21816bab.010



Emerald Group Publishing Limited

Copyright © 1999, MCB UP Limited

Zevatech forms new advanced transfer division

Zevatech forms new advanced transfer division

Keyword Zevatech

Zevatech® Inc. have formed an advanced technology division dedicated to meeting the needs of customers with advanced component placement. As a response to the ever-growing demand for bare die, flip chip and odd-form component handling in the semiconductor and SMD markets, this division will be responsible for providing solutions to these production challenges. The engineers, technicians and applications support for this division are located in the Morrsville, NC facility where they have begun the production and shipment of advanced pick-and-place systems (Plate 1). The AT division will also take on support responsibility for the customers of the former ATMI division in Melbourne, Florida as a part of Zevatech Inc's 40 percent expansion of the Morrisville facility.

Plate 1Zevatech advanced transfer division

Related articles