Semi Dice announces kick-off of third annual bare die survey

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 August 1999

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Keywords

Citation

(1999), "Semi Dice announces kick-off of third annual bare die survey", Microelectronics International, Vol. 16 No. 2. https://doi.org/10.1108/mi.1999.21816bab.009

Publisher

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Emerald Group Publishing Limited

Copyright © 1999, MCB UP Limited


Semi Dice announces kick-off of third annual bare die survey

Semi Dice announces kick-off of third annual bare die survey

Keywords Dies, Semi Dice

Semi Dice has announced that it recently began conducting the third annual Semi Dice Inc. Bare Die Survey. Designed as a barometer of the bare die industry, the survey aims to evaluate, monitor and educate the electronics industry about bare die. The survey was sent to 46 semiconductor manufacturers and 56 circuit manufacturers across the USA.

The 1999 survey contains more in-depth questions about the state of bare die. Questions focus on technical issues and current and future opportunities for bare die use. The questions also address current and future trends in areas such as ceramic technology.

"The first two Semi Dice Inc. Bare Die Surveys had very high response rates ­ over 45 percent -- and the results provided a unique glimpse into our industry", said Mitch Myers, president and COO, Semi Dice. "We expect similar insight from the 1999 survey".

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