(1999), "IMAPS Brazil", Microelectronics International, Vol. 16 No. 2. https://doi.org/10.1108/mi.1999.21816bab.002
Emerald Group Publishing Limited
Copyright © 1999, MCB UP Limited
Keywords Brazil, IMAPS
Call for Papers ICMP '99 14th International Conference on Microelectronics and Packaging 3-6 August 1999 Iguassu Falls, Brazil
Since 1986, The Brazilian Microelectronics Society has sponsored an annual event which has been recognised as a forum for experts from all over the world, sharing the most recent advances in semiconductor technology, IC design methodologies, fabrication processes, test, CAE tools, VLSI technology and systems engineering.
As a result of the co-sponsorship last year by the International Microelectronics and Packaging Society (IMAPS), technical sessions on packaging technology have been included in the scope of the conference.
Interested parties are invited to visit our Web site at http://www.lpm2.fee.unicamp.br/icmp99 and we encourage you to submit a paper and honor us with your participation.
Please submit your abstracts to: Prof. Dr Carlos A. Reis, General Chair Faculty of Electrical Engineering, University of Campinas (Unicamp) Campinas, Sao Paulo, Brazil. Tel: +55 19 7883707; Fax: +55 19 2891395; E-mail: email@example.com