Wafer dicing and singulation system ideal for advanced materials

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 1999

51

Keywords

Citation

(1999), "Wafer dicing and singulation system ideal for advanced materials", Microelectronics International, Vol. 16 No. 1. https://doi.org/10.1108/mi.1999.21816aad.011

Publisher

:

Emerald Group Publishing Limited

Copyright © 1999, MCB UP Limited


Wafer dicing and singulation system ideal for advanced materials

Wafer dicing and singulation system ideal for advanced materials

Keywords Dicing, Manufacturing, Technology

Manufacturing Technology, Inc. (MTI) manufacturer of high precision, high performance slicing, dicing, grinding, grooving, slotting and abrasive systems latest machine system is the NSX-250 for advanced semiconductor applications. The NSX-250's system design is field-proven around the world in dicing difficult semiconductor materials such as gallium arsenide (GaAs), SiGe, composites (SO1), ceramics, PZT and other advanced materials where precision and production requirements are critical. Additionally, the system's design features allow for high productivity and flexibility for CSP and fiber reinforced package singulation.

Designed and manufactured in the USA, the NSX-250 offers unparalleled machine rigidity, a unique overarm spindle support, multi-layer vibration isolation, Windows™ based CNC controls and MTIvision™ NT for automatic alignment, index correction and inspection.

MTI supports its system with diamond wheels, hubs, tooling and process development providing turnkey solutions for the most demanding applications.

The NSX Series features: Aged Meehenite™ heavy walled castings, Z over Y design for high accuracy over full travel range, oversized precision rails and ball screws for stiffness and reliability. The full four axes CNC functionality allows axis interpolation, plunge cuts, in-process dressing programs, multiple processes and more.

The low maintenance, small floorspace design permits systems to be stacked for maximizing throughput per square footage. The system offers a large working envelope for tooling flexibility and has spindle options for wheels from 2" to 6" in diameter.

For further information please contact http://www.mtionline.com

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