New backside silicon image enhancing software

Microelectronics International

ISSN: 1356-5362

Article publication date: 1 April 1999

77

Keywords

Citation

(1999), "New backside silicon image enhancing software", Microelectronics International, Vol. 16 No. 1. https://doi.org/10.1108/mi.1999.21816aad.008

Publisher

:

Emerald Group Publishing Limited

Copyright © 1999, MCB UP Limited


New backside silicon image enhancing software

New backside silicon image enhancing software

Keywords Hypervision, Software

New software that greatly improves critical reference images in backside emission imaging is now available from Hypervision, the maker of emission microscope systems (Plates 4a and 4b).

Emission images locate chip-level static and functional defects. The first step in backside imaging is thinning of the silicon to as little as 80 microns. The complete emission image consists of an overlay of:

  1. 1.

    the light emitted by defects; and

  2. 2.

    the illuminated reference image showing circuitry.

The new software eliminates glare from the polished silicon and yields a complete overlay image in which contrast and resolution are similar to those in conventional frontside emission images. Backside imaging is a necessity for advanced DRAMS, LQCs, flip chips and other designs where the front side is inaccessible.

Plate 4aBackside image at 50× before enhancement correction

Plate 4bBackside image at 50× after enhancement correction

The new image enhancing software is designed for use with Hypervision's BEAMS™ and BEAMS Jr™ emission microscope systems. Significant image enhancement for contrast and sharpness is achieved.

For more information about the image enhancing software, contact Daniel T. Hurley, vice president, Hypervision Inc., 46560 Fremont Blvd., Suite 415, Fremont, CA 94538, USA. Tel: +1 (510) 651-7768; Fax: +1 (510) 651-1415; E-mail: danielhurley@compuserve.com.

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