IMAPS expands scope of Denver conference and gives it a new name

Citation

(1999), "IMAPS expands scope of Denver conference and gives it a new name", Microelectronics International, Vol. 16 No. 1. https://doi.org/10.1108/mi.1999.21816aac.004

IMAPS expands scope of Denver conference and gives it a new name

IMAPS expands scope of Denver conference and gives it a new name

Keywords Conference, IMAPS, Multichip module

IMAPS has changed the name of its MCM Conference to the International Conference and Exhibition on High Density Packaging and MCMs. The change has been made to reflect the transformation that this conference has undergone over the past two to three years. The conference is the leading technology and industry event dedicated to the advancement of HDP and MCMs

René Coté, general chair of this year's conference stated: "The conference was initially aimed exclusively at multichip modules. We then expanded its focus to include flip chips, chip scale packaging, known good die and high density interconnect on flex. This year, we are adding sessions on 3-D packaging, integrated passives and the emerging technologies of superconductors, exotic substrates and optical. The new name better reflects the expanded nature of the conference".

The HDP and MCMs Denver '99 conference and exhibition will be held at the newly redecorated Adam's Mark Hotel in Denver, Colorado, 7-9 April. For more information, contact the IMAPS home page http//:www.imaps.org