Citation
(1999), "ITRI releases BGA guidelines report", Microelectronics International, Vol. 16 No. 1. https://doi.org/10.1108/mi.1999.21816aab.010
Publisher
:Emerald Group Publishing Limited
Copyright © 1999, MCB UP Limited
ITRI releases BGA guidelines report
ITRI releases BGA guidelines report
The Interconnection Technology Research Institute (ITRI) has released the findings of a three-year investigation into the use of ball grid array (BGA) packaging for space flight applications, The Ball Grid Array Packaging Guidelines Report is the culmination of one of the most significant joint efforts ever performed to characterize this emerging technology.
In 1995, the Jet Propulsion Laboratory (JPL) at the California Institute of Technology solicited industrial, academic and other related consortia to work together to leverage their resources and expertise on BGA technology, The wide industrial use of BGA technology will afford NASA, as well as consortium to industries, inexpensive access to this technology and support miniaturization thrusts for their next generation applications.
The project team used a design of experiment (DOE) test matrix to evaluate the design, manufacturing, and material variables that the team determined were most critical for BGAs. Some of the most critical variables in the DOE included:
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Inspection technique, including X-ray, acoustic imaging and visual inspection of peripheral joints.
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Package type and array configuration, including peripheral versus full array, overmolded versus metallic version (Super BGA®), BGA versus quad flat pack (QFP), and plastic versus ceramic BGAs.
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Environmental stress performance, including several temperature profiles, power cycling and vibration.
For the project, ITRI provided a vehicle for collaboration among the various sectors of the electronic interconnection industry. The other organizations involved in the consortium:
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Academia The Rochester Institute of Technology.
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Military Hughes Missile Systems Company, Boeing Defense and Space Group and Loral (Lockheed-Martin), Canada.
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Commercial Amkor/Anam Electronics, Inc.
This is the final report for the project. It describes the rationale behind the project, the formation of the DOE, the design and fabrication of test vehicles, and the results and lessons learned from implementation of the DOE. The report also includes analysis of the results of environmental stressing and predictions of cycles to failure based in Weibull plots.
Copies of the Ball Grid Array Packaging Guidelines Report are free to ITRI members and are $250 for non-ITRI members, Contact Diana Hempstead, ITRI administrator, at (512) 833-9930, for more information on this report.