Radiation-hardened flip-flop for single event upset tolerance
Microelectronics International
ISSN: 1356-5362
Article publication date: 2 February 2023
Issue publication date: 17 March 2023
Abstract
Purpose
The purpose of this paper is to present a transition detector (TD)-based radiation hardened flip-flop (TDRH-FF) for single event upset (SEU).
Design/methodology/approach
With SEU recovery and single event transient (SET) detector mechanism, the TDRH-FF can tolerate SEU during hold mode and generate a warning signal for architecture-level recovery during transport mode when input signal contains SET. Evaluation results show that the TDRH-FF outperforms comparable comprehensive performance.
Findings
Simulation results show that 1) the mean pulse width of the correction glitches (at full width half maximum) of TDRH-FF is less than 10 ps; 2) the area overhead of TDRH-FF is similar to the EVFERST-FF, BISER-FF and DNURHL-FF; 3) TDRH-FF has the same average power consumption as SETTOF, and moderate PDP and Ps values among these compared FFs.
Originality/value
In this paper, a TD-based TDRH-FF is proposed to solve the problems in the previous design. And the main contributions of the proposed TDRH-FF are summarized: Minimum size transistors are used in the proposed TD which leads to a considerable decrease in area overheads and propagation delay (resulting in an ignorable correction glitch); and compared with other radiation hardened flip-flop, TDRH-FF outperforms comparable comprehensive performance.
Keywords
Acknowledgements
This work was supported by China Postdoctoral Science Foundation Funded Project Number 2021T140156; public service platform construction project for integrated circuit and chip industry (Grant Number CEIEC-2020-ZM02-0093/4); and the project of State Key Laboratory of Intense Pulsed Radiation Simulation and Effect (Grant Numbers SKLIPR1912 and SKLIPR2112).
Citation
Qi, C., Ma, G., Zhang, Y., Wang, T., Rui, E., Jiao, Q., Liu, C., Huo, M. and Zhai, G. (2023), "Radiation-hardened flip-flop for single event upset tolerance", Microelectronics International, Vol. 40 No. 2, pp. 89-95. https://doi.org/10.1108/MI-06-2022-0110
Publisher
:Emerald Publishing Limited
Copyright © 2022, Emerald Publishing Limited