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PWB Interconnect Strategy Using a Full Build Electroless Copper Plating System: Part 4: The Future of the FBE Process

K. Minten (AMP + AKZO, Carolina Circuits, Greenville, South Carolina, USA)
K. Kitchens (AMP + AKZO, Carolina Circuits, Greenville, South Carolina, USA)
J. Cisson (AMP + AKZO, Carolina Circuits, Greenville, South Carolina, USA)

Circuit World

ISSN: 0305-6120

Article publication date: 1 February 1994

Abstract

In the preceding three parts of this series, the authors have extensively reviewed and quantified the special processing sequences required for the ‘additive’ and ‘semi‐additive’ process strategies of PWB manufacture. In this, the fourth part of the series of five, they wish to present a series of full build processes which meet all the interconnect requirements of the 1990s while eliminating the drawbacks traditionally associated with additive processes.

Citation

Minten, K., Kitchens, K. and Cisson, J. (1994), "PWB Interconnect Strategy Using a Full Build Electroless Copper Plating System: Part 4: The Future of the FBE Process", Circuit World, Vol. 20 No. 3, pp. 5-14. https://doi.org/10.1108/eb046257

Publisher

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MCB UP Ltd

Copyright © 1994, MCB UP Limited