Immersion, Non‐electrolytic Tin/lead Plating Process

Abstract

The technological development and characteristics of an innovative process and composition for immersion plating and fusing of a solderable tin/lead deposit over copper are discussed. The process offers a viable alternative to hot air solder levelling, electrodeposition/selective stripping, or inhibitor coatings for maintaining solderability of printed wiring boards. A flat, uniform solderable tin/lead coating on all feature surfaces and edges is achieved. A number of important benefits are derived. The ability to coat any copper surface uniformly, including fine pitch features, is substantially enhanced. Solderability is improved because of a thick, flat, co‐planar and uniform tin/lead deposit on all copper surfaces. Typical thickness and composition of the fused alloy are 150 to 300 microinches (4 to 8 microns) and 65 to 75% tin.

Citation

Couble, E.C., Dutkewych, O.B., Florio, S.M., Marsh, M.V. and Staniunas, R.F. (1992), "Immersion, Non‐electrolytic Tin/lead Plating Process", Circuit World, Vol. 19 No. 1, pp. 63-70. https://doi.org/10.1108/eb046192