Acid Copper Plating High Aspect Ratio Multilayer Circuit Boards

W.A. Fairweather (PMD (UK) Ltd, Coventry, England)

Circuit World

ISSN: 0305-6120

Publication date: 1 April 1992

Abstract

The throwing power of the acid copper plating process is affected by solution composition, organic additives, plating conditions and bath geometry. Recommendations for optimising these areas are given and production experiences reported.

Citation

Fairweather, W.A. (1992), "Acid Copper Plating High Aspect Ratio Multilayer Circuit Boards", Circuit World, Vol. 19 No. 1, pp. 53-62. https://doi.org/10.1108/eb046190

Publisher

:

MCB UP Ltd

Copyright © 1992, MCB UP Limited

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