Acid Copper Plating High Aspect Ratio Multilayer Circuit Boards
W.A. Fairweather
(PMD (UK) Ltd, Coventry, England)
38
Abstract
The throwing power of the acid copper plating process is affected by solution composition, organic additives, plating conditions and bath geometry. Recommendations for optimising these areas are given and production experiences reported.
Citation
Fairweather, W.A. (1992), "Acid Copper Plating High Aspect Ratio Multilayer Circuit Boards", Circuit World, Vol. 19 No. 1, pp. 53-62. https://doi.org/10.1108/eb046190
Publisher
:MCB UP Ltd
Copyright © 1992, MCB UP Limited