A through‐plating facility designed by Heraeus eliminates the need for electroless copper. The new compact facility, which can handle printed circuit boards measuring up to 250 x 450 mm, is easy to operate and causes no damage to the environment. In spite of dispensing with electroless copper, complexing agents and formaldehyde, a high degree of quality in the through‐plating of drilled holes is achieved.
MCB UP Ltd
Copyright © 1992, MCB UP Limited