A through‐plating facility designed by Heraeus eliminates the need for electroless copper. The new compact facility, which can handle printed circuit boards measuring up to 250 x 450 mm, is easy to operate and causes no damage to the environment. In spite of dispensing with electroless copper, complexing agents and formaldehyde, a high degree of quality in the through‐plating of drilled holes is achieved.
(1992), "New Products", Circuit World, Vol. 18 No. 2, pp. 55-55. https://doi.org/10.1108/eb046162
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