To read the full version of this content please select one of the options below:

New Products

Circuit World

ISSN: 0305-6120

Article publication date: 1 January 1992

Abstract

A through‐plating facility designed by Heraeus eliminates the need for electroless copper. The new compact facility, which can handle printed circuit boards measuring up to 250 x 450 mm, is easy to operate and causes no damage to the environment. In spite of dispensing with electroless copper, complexing agents and formaldehyde, a high degree of quality in the through‐plating of drilled holes is achieved.

Citation

(1992), "New Products", Circuit World, Vol. 18 No. 2, pp. 55-55. https://doi.org/10.1108/eb046162

Publisher

:

MCB UP Ltd

Copyright © 1992, MCB UP Limited