TY  - JOUR
AB  - Insulated Metal Substrates (IMS) have been used in the automotive industry for a number of years. The popularity of this technology is due to the good thermal conductivity of the thin insulation material, which is more effective than convection cooling, and the high temperature performance of the adhesive used for under‐bonnet applications. This paper describes how IMS circuits can be designed and manufactured with two or more layers without using the traditional plating processes.
VL  - 18
IS  - 2
SN  - 0305-6120
DO  - 10.1108/eb046156
UR  - https://doi.org/10.1108/eb046156
AU  - Kemkes J.
AU  - Melchior F.
AU  - Weinhold M.
PY  - 1992
Y1  - 1992/01/01
TI  - A New Technology for the Design and Manufacture of Two‐layer and Multilayer ‘Semi‐flexible’ Circuits for Automotive Applications
T2  - Circuit World
PB  - MCB UP Ltd
SP  - 27
EP  - 31
Y2  - 2024/05/07
ER  -